2024 Committee

Industry Chair:
Koji Yamada, AIST, Japan

Topic Co-Chair:
Nobuhiko Nishiyama, Tokyo Institute of Technology, Japan

Topic Co-Chair:
Di Liang, Alibaba Group, USA

Committee Members:
Tomohiro Kita Waseda, University, Japan
Kei May Lau, Hongkong University of Science and Technology, Hongkong
Stefan Lischke, IHP – Leibniz Institute for High Performance Microelectronics, Germany
Liu Liu, Zhejiang University, China
Songtao Liu, Intel Corporation, USA
Patrick Lo, Advanced Micro Foundry Pte Ltd, Singapore
Takuya Okimoto, Sumitomo, Japan
Graham Reed, University of Southampton, UK
Chen Shang, UC Santa Barbara, USA
Junichi Suzuki, Mitsubishi-Electric, Japan
Shin Tanaka, Fujitsu, Japan
Bassem Tossoun, Hewlett Packard Labs, USA

Topic Co-Chair:
Lars Zimmermann, IHP, Germany

Topic Co-Chair:
Yung-Jr Hung, Sun Yat-sen University Taiwan, Taiwan

Committee Members:
Wim Bogaerts, Ghent University, Belgium
Tommaso Cassese, Silicon Austria Labs (SAL), Austria
Woo-Young Choi, Yonsei University, Korea
Kazuhiko Kurata, AIO Core Co., Ltd., Japan
Ming-Chang Lee, National Tsing Hua University, Taiwan
Mitsumasa Nakajima, NTT, Japan
Mahdi Nikdast, Colorado State University, USA
Wei Shi, Universite Laval, Quebec, Canada
Chao Xiang, University of Hong Kong, China

Topic Co-Chair:
Guangwei Cong, AIST, Japan

Topic Co-Chair:
Yunhong Ding, Denmark Technical University, Denmark

Committee Members:
Jeremy Adcock, Bristol University, UK
Tao Chu, Zhejiang University, China
Martijn Heck, Eindhoven University of Technology (TU/e), EU
Shota Kita, NTT, Japan
Odile Liboiron-Ladouceur, McGill University, Canada
Minhao, Pu, DTU, EU
Xian Xiao, HPE, US
Linjie Zhou, SJTU, China

Topic Co-Chair:
Xinlun Cai, Sun Yat-sen University, China

Topic Co-Chair:
Alan Wang, Baylor University, USA

Committee Members:
Zengguang Cheng, Fudan University, China
Tingyi Gu, University of Delaware, USA
Ranjeet Kumar, Intel Corp., USA
Mo Li, University of Washington, USA
Hidetaka Nishi, NTT, Japan
Carlos Rios Ocampo, University of Maryland, USA

Topic Co-Chair:
Yuya Shoji, Tokyo Institute of Technology, Japan

Topic Co-Chair:
Frederic Boeuf, STMicroelectronics, France

Committee Members:
Carlos Alonso-Ramos, Universite Paris-Saclay, France
Charles Baudot, Ciena, Canada
Daoxin Dai, Zhejiang University, China
Takeshi Fujisawa, Hokkaido University, Japan
Karim Hassan, CEA-LETI, France
Zhihong Huang, HPE Labs, USA
Ueli Koch, ETH, Switzerland
Yuriko Maegami, AIST, Japan
Paolo Pintus, University of Cagliari, Italy
Hanyo Rhee, SICOYA, Germany
Mitsuru Takenaka, University of Tokyo, Japan